Touch display device

ABSTRACT

Embodiments of the present disclosure are related to a touch display device, as a touch insulating film positioned under a touch electrode has a step difference and the touch electrode is disposed along a surface of the touch insulating film having the step difference. Thus, an area of the touch electrode disposed on an identical region increases and touch sensitivity can be improved. Furthermore, since the touch electrode is positioned lower toward from a central portion to an outer portion, a structure of the touch electrode being capable of improving touch sensitivity can be implemented without reducing a viewing angle of a light emitted from a light-emitting element positioned under the touch electrode.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority from Republic of Korea PatentApplication No. 10-2021-0084407, filed on Jun. 29, 2021, which is herebyincorporated by reference in its entirety.

BACKGROUND Field

Embodiments of the present disclosure are related to a touch displaydevice.

Description of Related Art

The growth of the information society leads to increased demand fordisplay devices to display images and use of various types of displaydevices, such as liquid crystal display devices, organic light emittingdisplay devices, etc.

The display devices, for providing more functions, provide a functionthat recognizes a touch by a finger or a pen of the user being contactedto a display panel and performs an input process based on a recognizedtouch.

The display devices, for example, can include a plurality of touchelectrodes disposed on the display panel, or embedded in the displaypanel.

The display devices can drive the touch electrode, and sense a touch ofa user of the display panel by detecting a change of a capacitancegenerated by the touch of the user.

Various electrodes for a display driving other than the touch electrodecan be included in the display panel. Thus, there is a problem that aperformance of a touch detection can be reduced due to a parasiticcapacitance between the touch electrode and the electrode for thedisplay driving.

SUMMARY

Embodiments of the present disclosure can provide a touch display devicebe capable of improving a performance of touch detection by a touchelectrode included in a display panel without reducing a performance ofa display driving.

Embodiments of the present disclosure can provide a touch display devicecomprising a substrate on which a plurality of light-emitting elementsare disposed, an encapsulation layer sealing the plurality oflight-emitting elements, a plurality of touch electrode lines disposedon the encapsulation layer, being made of at least a part of a firsttouch sensor metal disposed on a first layer on the encapsulation layerand a second touch sensor metal at least partially disposed on a secondlayer on the first layer, and an area of the second touch sensor metalis greater than an area of the first touch sensor metal, and a touchinsulating film disposed on at least a part area of an area between thefirst layer and the second layer, and including a first portion having afirst thickness and a second portion having a second thickness smallerthan the first thickness positioned under the second touch sensor metal.

Embodiments of the present disclosure can provide a touch display devicecomprising a substrate on which a plurality of light-emitting elementsare disposed, an encapsulation layer sealing the plurality oflight-emitting elements, a first touch sensor metal disposed on a firstlayer on the encapsulation layer, a second touch sensor metal disposedon a second layer on the first layer, and a touch insulating filmdisposed on at least a part area of an area between the first layer andthe second layer, and including a first portion having a first thicknessand a second portion having a second thickness smaller than the firstthickness positioned on an area overlapping the second touch sensormetal.

Embodiments of the present disclosure can provide a touch display devicecomprising a substrate on which a plurality of light-emitting elementsare disposed, an encapsulation layer sealing the plurality oflight-emitting elements, a plurality of touch electrode connecting linesdisposed on a first layer on the encapsulation layer, a plurality oftouch electrodes disposed on a second layer on the first layer, and atouch insulating film disposed on at least a part area of an areabetween the first layer and the second layer, wherein a top surface ofeach of the plurality of touch electrode connecting lines is flat, and atop surface of at least one of the plurality of touch electrodes iscurved.

According to various embodiments of the present disclosure, as a touchelectrode is disposed along a top surface of a touch insulating filmhaving a step difference, an area of the touch electrode can increaseand thus a touch display device improving touch sensitivity can beprovided.

Furthermore, as the touch electrode is disposed along an inclinedsurface of the touch insulating film and an area of the touch electrodeincrease, thus the touch display device not to drop a viewing angle of adisplay panel can be provided while improving touch sensitivity.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a diagram illustrating a system configuration of a touchdisplay device according to embodiments of the present disclosure;

FIG. 2 is a diagram schematically illustrating a display panel of atouch display device according to embodiments of the present disclosure;

FIG. 3 is a diagram illustrating a structure in which a touch panel isdisposed as an in-cell structure in a display panel according toembodiments of the present disclosure;

FIGS. 4, 5A, and 5B are diagrams illustrating different types of touchelectrodes disposed in a display panel according to embodiments of thepresent disclosure;

FIG. 6 is a diagram illustrating the mesh-shaped touch electrodeillustrated in FIG. 5A according to an embodiment of the presentdisclosure;

FIG. 7 is a diagram schematically illustrating a touch sensor structurein a display panel according to embodiments of the present disclosure;

FIG. 8 is a diagram illustrating an example of the touch sensorstructure illustrated in FIG. 7 according to an embodiment of thepresent disclosure;

FIG. 9 is a cross-sectional diagram illustrating portions of the displaypanel taken along line X-X′ in FIG. 8 according to embodiments of thepresent disclosure;

FIGS. 10 and 11 are diagrams illustrating a cross-sectional structure ofa display panel including a color filter according to embodiments of thepresent disclosure;

FIG. 12 is a plane view illustrating an example of a structure of atouch electrode disposed in a display panel according to embodiments ofthe present disclosure;

FIG. 13 is a cross-sectional view of I-I′ portion illustrated in FIG. 12according to an embodiment of the present disclosure;

FIG. 14 is a cross-sectional view of II-II′ portion illustrated in FIG.12 according to an embodiment of the present disclosure;

FIG. 15 is a cross-sectional view of III-III′ portion illustrated inFIG. 12 according to an embodiment of the present disclosure;

FIG. 16 is a plane view illustrating another example of a structure of atouch electrode disposed in a display panel according to embodiments ofthe present disclosure;

FIG. 17 is a cross-sectional view of IV-IV′ portion illustrated in FIG.16 according to an embodiment of the present disclosure;

FIG. 18 is a plane view illustrating other example of a structure of atouch electrode disposed in a display panel according to embodiments ofthe present disclosure;

FIG. 19 is a cross-sectional view of V-V′ portion illustrated in FIG. 18according to an embodiment of the present disclosure;

FIG. 20 is a plane view illustrating other example of a structure of atouch electrode disposed in a display panel according to embodiments ofthe present disclosure; and

FIG. 21 is a cross-sectional view of VI-VI′ portion illustrated in FIG.20 according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

In the following description of examples or embodiments of the presentdisclosure, reference will be made to the accompanying drawings in whichit is shown by way of illustration specific examples or embodiments thatcan be implemented, and in which the same reference numerals and signscan be used to designate the same or like components even when they areshown in different accompanying drawings from one another. Further, inthe following description of examples or embodiments of the presentdisclosure, detailed descriptions of well-known functions and componentsincorporated herein will be omitted when it is determined that thedescription may make the subject matter in some embodiments of thepresent disclosure rather unclear. The terms such as “including”,“having”, “containing”, “constituting” “make up of”, and “formed of”used herein are generally intended to allow other components to be addedunless the terms are used with the term “only”. As used herein, singularforms are intended to include plural forms unless the context clearlyindicates otherwise.

Terms, such as “first”, “second”, “A”, “B”, “(A)”, or “(B)” may be usedherein to describe elements of the present disclosure. Each of theseterms is not used to define essence, order, sequence, or number ofelements etc., but is used merely to distinguish the correspondingelement from other elements.

When it is mentioned that a first element “is connected or coupled to”,“contacts or overlaps” etc. a second element, it should be interpretedthat, not only can the first element “be directly connected or coupledto” or “directly contact or overlap” the second element, but a thirdelement can also be “interposed” between the first and second elements,or the first and second elements can “be connected or coupled to”,“contact or overlap”, etc. each other via a fourth element. Here, thesecond element may be included in at least one of two or more elementsthat “are connected or coupled to”, “contact or overlap”, etc. eachother.

When time relative terms, such as “after,” “subsequent to,” “next,”“before,” and the like, are used to describe processes or operations ofelements or configurations, or flows or steps in operating, processing,manufacturing methods, these terms may be used to describenon-consecutive or non-sequential processes or operations unless theterm “directly” or “immediately” is used together.

In addition, when any dimensions, relative sizes etc. are mentioned, itshould be considered that numerical values for an elements or features,or corresponding information (e.g., level, range, etc.) include atolerance or error range that may be caused by various factors (e.g.,process factors, internal or external impact, noise, etc.) even when arelevant description is not specified. Further, the term “may” fullyencompasses all the meanings of the term “can”.

Hereinafter, various embodiments of the present disclosure will bedescribed in detail with reference to accompanying drawings.

FIG. 1 is a diagram illustrating a system configuration of a touchdisplay device according to embodiments.

Referring to FIG. 1 , the touch display device according to embodimentsof the present disclosure can provide both an image display function anda touch-sensing function.

To provide the image display function, the touch display deviceaccording to embodiments of the present disclosure can comprise adisplay panel DISP in which a plurality of data lines and a plurality ofgate lines are disposed and a plurality of subpixels defined by theplurality of data lines and the plurality of gate lines are arrayed, adata driver (or data driver circuit) DDC driving the plurality of datalines, a gate driver (or gate driver circuit) GDC driving the pluralityof gate lines, a display controller DCTR controlling the data driver DDCand gate driver GDC, and the like.

Each of the data driver DDC, the gate driver GDC, and the displaycontroller DCTR can be implemented as one or more separate components.In some cases, two or more of the data driver DDC, the gate driver GDC,and the display controller DCTR can be integrated into a singlecomponent. For example, the data driver DDC and the display controllerDCTR can be implemented as a single integrated circuit (IC) chip.

To provide the touch-sensing function, the touch display deviceaccording to embodiments of the present disclosure can comprise a touchpanel TSP including a plurality of touch electrodes and a touch-sensingcircuit TSC supplying a touch driving signal to the touch panel TSP,detecting a touch-sensing signal from the touch panel TSP, and detectinga touch of a user or determining a touch position (touch coordinates) onthe touch panel TSP on the basis of a detected touch-sensing signal.

For example, the touch-sensing circuit TSC can comprise a touch drivingcircuit TDC supplying a touch driving signal to the touch panel TSP anddetecting a touch-sensing signal from the touch panel TSP and, a touchcontroller TCTR determining at least one of the touch of the user andthe touch coordinates on the basis of the touch-sensing signal detectedby the touch driving circuit TDC, and the like.

The touch driving circuit TDC can comprise a first circuit partsupplying the touch driving signal to the touch panel TSP and a secondcircuit part detecting the touch-sensing signal from the touch panelTSP.

The touch driving circuit TDC and the touch controller TCTR can beprovided as separate components or, in some cases, can be integratedinto a single component.

In addition, each of the data driver DDC, the gate driver GDC, and thetouch driving circuit TDC is implemented as one or more ICs, and interms of electrical connection to the display panel DISP, can have achip-on-glass (COG) structure, a chip-on-film (COF) structure, a tapecarrier package (TCP) structure, or the like. In addition, the gatedriver GDC can have a gate-in-panel (GIP) structure.

In addition, each of the circuit configurations DDC, GDC, and DCTR fordisplay driving and the circuit configurations TDC and TCTR for touchsensing can be implemented as one or more separate components. In somecases, one or more of the display driving circuit configurations DDC,GDC, and DCTR and one or more of the touch-sensing circuitconfigurations TDC and TCTR can be functionally integrated into one ormore components.

For example, the data driver DDC and the touch driving circuit TDC canbe integrated into one or more integrated circuit (IC) chips. In a casein which the data driver DDC and the touch driving circuit TDC areintegrated into two or more IC chips, each of the two or more IC chipscan have both a data driving function and a touch driving function.

In addition, the touch display device according to embodiments of thepresent disclosure can be various types of devices, such as an organiclight-emitting diode (OLED) display device and a liquid crystal display(LCD) device. Hereinafter, the touch display device will be described asan OLED display device for the sake of brevity. That is, although thedisplay panel DISP can be various types of devices, such as an OLED andan LCD, the display panel DISP will be described as an OLED panel as anexample for the sake of brevity.

In addition, as will be described later, the touch panel TSP cancomprise a plurality of touch electrodes to which the touch drivingsignal is applicable or from which the touch-sensing signal isdetectable; a plurality of touch routing lines connecting the pluralityof touch electrodes to the touch driving circuit TDC; and the like.

The touch panel TSP can be located outside of the display panel DISP.That is, the touch panel TSP and the display panel DISP can befabricated separately and combined thereafter. Such a touch panel TSP isreferred to as an add-on touch panel.

Alternatively, the touch panel TSP can be disposed inside of the displaypanel DISP (i.e., integrated into the display panel DISP). That is, whenthe display panel DISP is fabricated, touch sensor structures of thetouch panel TSP, including the plurality of touch electrodes, theplurality of touch routing lines, and the like, can be provided togetherwith electrodes and signal lines used for the display driving. Such atouch panel TSP is referred to as an in-cell touch panel. Hereinafter,for the sake of brevity, the touch panel TSP will be described as anin-cell touch panel TSP as an example.

FIG. 2 is a diagram schematically illustrating the display panel DISP ofthe touch display device according to embodiments of the presentdisclosure.

Referring to FIG. 2 , the display panel DISP can comprise an active areaAA on which images are displayed and a non-active area NA locatedoutside of an outer boundary line BL of the active area AA.

In the active area AA of the display panel DISP, a plurality ofsubpixels for displaying images are arrayed, and a variety of electrodesand signal lines for the display driving area are disposed.

In addition, the plurality of touch electrodes for the touch sensing,the plurality of touch routing lines electrically connected to theplurality of touch electrodes, and the like can be disposed in theactive area AA of the display panel DISP. Accordingly, the active areaAA can also be referred to as a touch-sensing area in which the touchsensing can be performed.

In the non-active area NA of the display panel DISP, link lines producedby extending a variety of signal lines disposed in the active area AA orlink lines electrically connected to the variety of signal linesdisposed in the active area AA and pads electrically connected to thelink lines can be disposed. The pads disposed in the non-active area NAcan be bonded or electrically connected to the display driving circuits,such as DDC and GDC.

In addition, in the non-active area NA of the display panel DISP, linklines produced by extending a plurality of touch routing lines disposedin the active area AA or link lines electrically connected to theplurality of touch routing lines disposed in the active area AA and padselectrically connected to the link lines can be disposed. The padsdisposed in the non-active area NA can be bonded or electricallyconnected to the touch driving circuit TDC.

In the non-active area NA, portions produced by expanding portions ofthe outermost touch electrodes among the plurality of touch electrodesdisposed in the active area AA can be provided, and one or moreelectrodes (e.g., touch electrodes) made of the same material as theplurality of touch electrodes disposed in the active area AA can befurther disposed.

That is, the entirety of the plurality of touch electrodes disposed inthe display panel DISP can be located in the active area AA, specifictouch electrodes (e.g., the outermost touch electrodes) among theplurality of touch electrodes disposed in the display panel DISP can belocated in the non-active area NA, or specific touch electrodes (e.g.,the outermost touch electrodes) among the plurality of touch electrodesdisposed in the display panel DISP can extend across at least a portionof the active area AA and at least a portion of the non-active area NA.

In addition, referring to FIG. 2 , the display panel DISP of the touchdisplay device according to embodiments of the present disclosure cancomprise a dam area DA in which a dam DAM (see FIG. 9 ) is disposed, thedam DAM serving to prevent or at least reduce collapsing of a layer(e.g., an encapsulation layer in the OLED display panel) in the activearea AA.

The dam area DA can be located at the boundary between the active areaAA and the non-active area NA, in a location of the non-active area NAat the periphery of the active area AA, or the like.

The dam disposed in the dam area DA can be disposed to surround theactive area AA in all directions or only at the periphery of one or moreportions (e.g., portions in which a fragile layer is located) of theactive area AA.

The dams disposed in the dam area DA can be connected to be made as asingle pattern or to be made as two or more separate patterns. Inaddition, in the dam area DA, only a first dam can be disposed, or twodams (e.g., a first dam and a second dam) can be disposed, or three ormore dams can be disposed.

In the dam area DA, the first dam can only be provided in one direction,and both the first dam and the second dam can be provided in the otherdirection.

FIG. 3 is a diagram illustrating a structure in which the touch panelTSP is disposed as an in-cell structure in the display panel DISPaccording to embodiments of the present disclosure.

Referring to FIG. 3 , a plurality of subpixels SP are arrayed on asubstrate SUB in the active area AA of the display panel DISP.

Each of the subpixels SP can comprise an emitting device ED, a firsttransistor T1 driving the emitting device ED, a second transistor T2delivering a data voltage VDATA to a first node N1 of the firsttransistor T1, a storage capacitor Cst maintaining a predeterminedvoltage for a single frame, and the like.

The first transistor T1 can comprise the first node N1 to which the datavoltage VDATA is applicable, a second node N2 electrically connected tothe emitting device ED, and a third node N3 to which a driving voltageis applied from a driving voltage line DVL. The first node N1 can be agate node, the second node N2 can be a source node or a drain node, andthe third node N3 can be a drain node or a source node. Such a firsttransistor T1 is also referred to as a driving transistor driving theemitting device ED.

The emitting device ED can comprise a first electrode (e.g., an anode),an emissive layer, and a second electrode (e.g., a cathode). The firstelectrode can be electrically connected to the second node N2 of thefirst transistor T1, and the second electrode can have a base voltageVSS applied thereto.

The emissive layer of the emitting device ED can be an organic emissivelayer containing an organic material. In this case, the emitting deviceED can be an organic light-emitting diode (OLED).

The second transistor T2 can be on/off controlled by a scan signal SCANapplied through a gate line GL and be electrically connected to thefirst node N1 of the first transistor T1 and a data line DL. Such asecond transistor T2 is also referred to as a switching transistor.

When the second transistor T2 is turned on by the scan signal SCAN, thesecond transistor T2 delivers the data voltage VDATA supplied throughthe data line DL to the first node N1 of the first transistor T1.

The storage capacitor Cst can be electrically connected to the firstnode N1 and the second node N2 of the first transistor T1.

As illustrated in FIG. 3 , each of the subpixels SP can have a 2T1Ccomprised of two transistors T1 and T2 and a single capacitor Cst. Insome cases, each of the subpixels SP can further comprise one or moretransistors or one or more capacitors.

The storage capacitor Cst can be an external capacitor intentionallydesigned to be disposed externally of the first transistor T1, ratherthan a parasitic capacitor (e.g., Cgs or Cgd), i.e., an internalcapacitor present between the first node N1 and the second node N2 ofthe first transistor T1.

Each of the first transistor T1 and the second transistor T2 can be ann-type transistor or a p-type transistor.

As described above, circuit components, including the emitting deviceED, two or more transistors T1 and T2, and one or more capacitor Cst,are disposed in the display panel DISP. Since such circuit components(in particular, the emitting device ED) are vulnerable to externalmoisture, oxygen, or the like, an encapsulation layer ENCAP preventingor at least reducing external moisture or oxygen from penetrating thecircuit elements (in particular, the emitting device ED) can be disposedin the display panel DISP.

Such an encapsulation layer ENCAP can be a single layer or have amultilayer structure.

In addition, in the touch display device according to embodiments of thepresent disclosure, the touch panel TSP can be disposed on theencapsulation layer ENCAP.

That is, in the touch display device, a touch sensor structure,including the plurality of touch electrodes TE, of the touch panel TSPcan be disposed on the encapsulation layer ENCAP.

During touch sensing, the touch driving signal or the touch-sensingsignal can be applied to the touch electrodes TE. Then, during the touchsensing, a potential difference can be produced between a touchelectrode TE and a cathode disposed on both sides of the encapsulationlayer ENCAP, thereby generating unnecessary parasitic capacitance. Sincesuch parasitic capacitance can reduce touch sensitivity, the distancebetween the touch electrode TE and the cathode can be designed to be apredetermined value (e.g., 1 μm) or more in consideration of thethickness of the panel, a panel fabrication process, displayperformance, and the like in order to reduce the parasitic capacitance.In this regard, for example, the thickness of the encapsulation layerENCAP can be designed to be 1 μm or more.

FIGS. 4, 5A, and 5B are diagrams illustrating different types of touchelectrodes TE disposed in the display panel DISP according toembodiments of the present disclosure.

As illustrated in FIG. 4 , each of the touch electrodes TE disposed inthe display panel DISP can be a plate-shaped electrode metal without anopen area. In this case, each of the touch electrodes TE can be atransparent electrode. That is, each of the touch electrodes TE can bemade of a transparent electrode material such that light emitted by theplurality of subpixels SP disposed below the touch electrodes TE canpass through the touch electrodes TE.

Alternatively, as illustrated in FIG. 5A or 5B, each of the touchelectrodes TE disposed in the display panel DISP can be an electrodemetal EM in the shape of a patterned mesh having two or more open areasOA.

A mesh shape can be a shape that a shape such as a tetragon is repeatedidentically such as an example illustrated in FIG. 5A. Alternatively,the mesh shape can be a shape that a shape such as an octagon isrepeated and a portion disposed as a straight shape along one directionis added. The mesh shape can be one of a various shapes being formed bythe electrode metal EM having opening areas OA other than examplesabove-mentioned.

The electrode metal EM is a portion substantially corresponding to thetouch electrode TE and is a portion to which the touch driving signal isapplied or from which the touch-sensing signal is detected.

As illustrated in FIG. 5A or 5B, in a case in which each of the touchelectrodes TE is the electrode metal EM in the shape of a patternedmesh, two or more open areas OA can be present in the area of the touchelectrode TE.

Each of the plurality of open areas OA provided in each of the touchelectrodes TE can correspond to the emitting area of one or moresubpixels SP. That is, the plurality of open areas OA are passagesallowing light emitted from the plurality of subpixels SP located therebelow to pass upward therethrough. Hereinafter, for the sake of brevity,each of the touch electrodes TE will be described as a mesh-shapedelectrode metal EM as an example.

The electrode metal EM corresponding to each of the touch electrodes TEcan be located on a bank disposed in an area, except for the emittingarea of two or more subpixels SP.

In addition, a method of fabricating a plurality of touch electrode TEcan comprise making a mesh-shaped electrode metal EM having a wider areaand then cutting the electrode metal EM to be made as a predeterminedpattern such that portions of the electrode metal EM are electricallyseparated from each other, thereby fabricating a plurality of touchelectrodes TE.

The outline of the touch electrode TE can have a tetragonal shape, suchas a diamond or a rhombus shape, as illustrated in FIGS. 4 and 5A. Theoutline of the touch electrode TE can have a rectangular shape such asillustrated in FIG. 5B. Alternatively, the outline of the touchelectrode TE can have a variety of other shapes, such as a triangle, apentagon, or a hexagon.

FIG. 6 is a diagram illustrating the mesh-shaped touch electrode TEillustrated in FIG. 5A according to an embodiment.

Referring to FIG. 6 , in the area of each of the touch electrodes TE,one or more dummy metals DM disconnected from the mesh-shaped electrodemetal EM can be provided.

The electrode metal EM is a portion substantially corresponding to thetouch electrode TE and is a portion to which the touch driving signal isapplied or from which the touch-sensing signal is detected. In contrast,the dummy metals DM are portions to which the touch driving signal isnot applied and from which the touch-sensing signal is not detected,although the dummy metals DM are portions located in the area of thetouch electrode TE. That is, the dummy metals DM can be electricallyfloating metals.

Thus, the electrode metal EM can be electrically connected to the touchdriving circuit TDC, but none of the dummy metals DM are electricallyconnected to the touch driving circuit TDC.

In the area of each of the entire touch electrodes TE, one or more dummymetals DM can be provided while being disconnected from the electrodemetals EM.

Alternatively, one or more dummy metals DM can be provided in the areaof each of specific touch electrodes TE among the entire touchelectrodes TE while being disconnected from the electrode metal EM. Thatis, no dummy metals DM can be provided in the areas of the other touchelectrodes TE.

The function of the dummy metals DM is related to a visibility issue. Ina case in which only the mesh-shaped electrode metal EM is present inthe area of the touch electrode TE without one or more dummy metals DMbeing present in the area of the touch electrode TE as illustrated inFIG. 5A, the outline of the electrode metal EM can appear on the screen,thereby causing a visibility issue.

In contrast, in a case in which one or more dummy metals DM are presentin the area of the touch electrode TE as illustrated in FIG. 6 , theoutline of the electrode metal EM appearing on the screen, e.g., thevisibility issue, can be prevented or at least reduced.

In addition, touch sensitivity can be improved by adjusting themagnitude of capacitance according to each of the touch electrodes TE byadjusting the presence or absence or the number (or ratio) of the dummymetals DM of each of the touch electrodes TE.

In addition, specific points of the electrode metal EM provided in thearea of a single touch electrode TE can be cut, so that the cutelectrode metal EM form dummy metals DM. That is, the electrode metal EMand the dummy metals DM can be made of the same material provided on thesame layer.

In addition, the touch display device according to embodiments of thepresent disclosure can detect a touch on the basis of capacitancegenerated on the touch electrode TE.

The touch display device according to embodiments of the presentdisclosure can detect a touch by a capacitance-based touch sensingmethod, more particularly, mutual capacitance-based touch sensing orself-capacitance-based touch sensing.

In the mutual capacitance-based touch sensing, the plurality of touchelectrodes TE can be divided into driving touch electrodes (ortransmitting touch electrodes) to which the touch driving signal isapplied and sensing touch electrodes (or receiving touch electrodes)detecting the touch sensing signal and generating capacitance togetherwith the driving touch electrodes.

In the mutual capacitance-based touch sensing, the touch-sensing circuitTSC detects a touch and determines touch coordinates on the basis ofchanges in the capacitance (e.g., mutual capacitance) occurring betweenthe driving touch electrodes and the sensing touch electrodes, dependingon the presence or absence of a pointer, such as a finger or a pen.

In the self-capacitance-based touch sensing, each of the touchelectrodes TE serves as both a driving touch electrode and a sensingtouch electrode. That is, the touch-sensing circuit TSC detects a touchand determines touch coordinates by applying the touch driving signal toone or more touch electrodes TE, detecting the touch-sensing signalthrough the touch electrode TE to which the touch driving signal isapplied, and recognizing changes in the capacitance between the pointer,such as a finger or a pen, and the touch electrode TE, on the basis ofthe detected touch-sensing signal. Accordingly, in theself-capacitance-based touch sensing, there is no difference between thedriving touch electrodes and the sensing touch electrodes.

As described above, the touch display device according to embodiments ofthe present disclosure can perform the touch sensing by the mutualcapacitance-based touch sensing or the self-capacitance-based touchsensing. Hereinafter, for the sake of brevity, the touch display deviceperforming the mutual capacitance-based touch sensing and having a touchsensor structure for the mutual capacitance-based touch sensing will bedescribed as an example.

FIG. 7 is a diagram schematically illustrating a touch sensor structurein the display panel DISP according to embodiments of the presentdisclosure, and FIG. 8 is a diagram illustrating an example of the touchsensor structure illustrated in FIG. 7 according to embodiments of thepresent disclosure.

Referring to FIG. 7 , the touch sensor structure for the mutualcapacitance-based touch sensing can comprise a plurality of X-touchelectrode lines X-TEL and a plurality of Y-touch electrode lines Y-TEL.Here, the plurality of X-touch electrode lines X-TEL and the pluralityof Y-touch electrode lines Y-TEL are located on the encapsulation layerENCAP.

Each of the plurality of X-touch electrode lines X-TEL can be disposedin a first direction, and the plurality of Y-touch electrode lines Y-TELcan be disposed in a second direction different from the firstdirection.

Herein, the first direction and the second direction can be differentdirections. For example, the first direction can be the X-axisdirection, while the second direction can be the Y-axis direction.Alternatively, the first direction can be the Y-axis direction, whilethe second direction can be the X-axis direction. In addition, the firstdirection and the second direction can intersect perpendicularly or donot intersect perpendicularly. In addition, the terms “column” and “row”as used herein are relative terms. The column and the row can beswitched depending on the viewing perspective.

Each of the plurality of X-touch electrode lines X-TEL can be comprisedof a plurality of X-touch electrodes X-TE electrically connected to eachother. Each of the plurality of Y-touch electrode lines Y-TEL can becomprised of a plurality of Y-touch electrodes Y-TE electricallyconnected to each other.

Here, the plurality of X-touch electrodes X-TE and the plurality ofY-touch electrodes Y-TE are electrodes included in the plurality oftouch electrodes TE, and have different functions.

For example, the plurality of X-touch electrodes X-TE constituting eachof the plurality of X-touch electrode lines X-TEL can be the drivingtouch electrodes, while the plurality of Y-touch electrodes Y-TEconstituting each of the plurality of Y-touch electrode lines Y-TEL canbe the sensing touch electrodes. In this case, each of the plurality ofX-touch electrode lines X-TEL corresponds to a driving touch electrodelines, and each of the plurality of Y-touch electrode lines Y-TELcorresponds to a sensing touch electrode line.

Alternatively, the plurality of X-touch electrodes X-TE constitutingeach of the plurality of X-touch electrode lines X-TEL can be thesensing touch electrodes, while the plurality of Y-touch electrodes Y-TEconstituting each of the plurality of Y-touch electrode lines Y-TEL canbe the driving touch electrodes. In this case, each of the plurality ofX-touch electrode lines X-TEL corresponds to the sensing touch electrodeline, and each of the plurality of Y-touch electrode lines Y-TELcorresponds to the driving touch electrode line.

A touch sensor metal TSM for the touch sensing can comprise a pluralityof touch routing lines TL in addition to the plurality of X-touchelectrode lines X-TEL and the plurality of Y-touch electrode linesY-TEL.

The plurality of touch routing lines TL can comprise one or more X-touchrouting lines X-TL connected to the plurality of X-touch electrode linesX-TEL, respectively, and one or more Y-touch routing lines Y-TLconnected to the plurality of Y-touch electrode lines Y-TEL,respectively.

Referring to FIG. 8 , each of the plurality of X-touch electrode linesX-TEL can comprise a plurality of X-touch electrodes X-TE disposed inthe same row (or column) and one or more X-touch electrode connectinglines X-CL electrically connecting the plurality of X-touch electrodesX-TE. Here, the X-touch electrode connecting lines X-CL respectivelyconnecting two adjacent X-touch electrodes X-TE can be metals integratedwith the two adjacent X-touch electrodes X-TE (see FIG. 8 ) or metalsconnected to the two adjacent X-touch electrodes X-TE via contact holes.

Each of the plurality of Y-touch electrode lines Y-TEL can comprise aplurality of Y-touch electrodes Y-TE disposed in the same column (orrow) and one or more Y-touch electrode connecting lines Y-CLelectrically connecting the plurality of Y-touch electrodes Y-TE. Here,the Y-touch electrode connecting lines Y-CL respectively connecting twoadjacent Y-touch electrodes Y-TE can be metals integrated with the twoadjacent Y-touch electrodes Y-TE or metals connected to the two adjacentY-touch electrodes Y-TE via contact holes (see FIG. 8 ).

In areas in which the X-touch electrode lines X-TEL intersect theY-touch electrode lines Y-TEL (e.g., touch electrode line intersectingareas), the X-touch electrode connecting lines X-CL can intersect theY-touch electrode connecting lines Y-CL.

In a case in which the X-touch electrode connecting lines X-CL intersectthe Y-touch electrode connecting lines Y-CL in the touch electrode lineintersecting areas as described above, the X-touch electrode connectinglines X-CL must be located on a layer different from that of the Y-touchelectrode connecting lines Y-CL.

Accordingly, the plurality of X-touch electrodes X-TE, the plurality ofX-touch electrode connecting lines X-CL, the plurality of Y-touchelectrodes Y-TE, the plurality of Y-touch electrode lines Y-TEL, and theplurality of Y-touch electrode connecting lines Y-CL can be located ontwo or more layers, such that the plurality of X-touch electrode linesX-TEL intersect the plurality of Y-touch electrode lines Y-TEL.

Referring to FIG. 8 , each of the plurality of X-touch electrode linesX-TEL is electrically connected to a corresponding X-touch pad X-TPthrough one or more X-touch routing lines X-TL. That is, the outermostX-touch electrode X-TE among the plurality of X-touch electrodes X-TEincluded in a single X-touch electrode line X-TEL is electricallyconnected to a corresponding X-touch pad X-TP via the X-touch routingline X-TL.

Each of the plurality of Y-touch electrode lines Y-TEL is electricallyconnected to corresponding Y-touch pads Y-TP through one or more Y-touchrouting lines Y-TL. That is, the outermost Y-touch electrodes Y-TE amongthe plurality of Y-touch electrodes Y-TE included in a single Y-touchelectrode line Y-TEL is electrically connected to the correspondingY-touch pads Y-TP through the Y-touch routing lines Y-TL.

In addition, as illustrated in FIG. 8 , the plurality of X-touchelectrode lines X-TEL and the plurality of Y-touch electrode lines Y-TELcan be disposed on the encapsulation layer ENCAP. That is, the pluralityof X-touch electrodes X-TE, constituting the plurality of X-touchelectrode lines X-TEL, and the plurality of X-touch electrode connectinglines X-CL can be disposed on the encapsulation layer ENCAP. Theplurality of Y-touch electrodes Y-TE, constituting the plurality ofY-touch electrode lines Y-TEL, and the plurality of Y-touch electrodeconnecting lines Y-CL can be disposed on the encapsulation layer ENCAP.

In addition, as illustrated in FIG. 8 , the plurality of X-touch routinglines X-TL electrically connected to the plurality of X-touch electrodelines X-TEL can be disposed on the encapsulation layer ENCAP and extendto a location in which the encapsulation layer ENCAP is not provided,thereby being electrically connected to a plurality of X-touch padsX-TP, respectively. The plurality of Y-touch routing lines Y-TLelectrically connected to the plurality of Y-touch electrode lines Y-TELcan be disposed on the encapsulation layer ENCAP and extend to alocation in which encapsulation layer ENCAP is not provided, therebybeing electrically connected to a plurality of Y-touch pads Y-TP,respectively. Here, the encapsulation layer ENCAP can be located in theactive area AA and, in some cases, can expand to the non-active area NA.

In addition, as described above, a dam area DA can be provided at theboundary between the active area AA and the non-active area NA or in thenon-active area NA at the periphery of the active area AA in order toprevent or at least reduce collapsing of a layer (e.g., an encapsulationin the OLED display panel) in the active area AA.

As illustrated in FIG. 8 , for example, a first dam DAM1 and a seconddam DAM2 can be disposed in the dam area DA. Here, the second dam DAM2can be located more outward than the first dam DAM1.

In a manner different from that illustrated in FIG. 8 , only the firstdam DAM1 can be located in the dam area DA. In some cases, not only thefirst dam DAM1 and the second dam DAM2 but also one or more additionaldam can be disposed in the dam area DA.

Referring to FIG. 8 , the encapsulation layer ENCAP can be located on aside of the first dam DAM1 or be located both on a side of and above thefirst dam DAM1.

FIG. 9 is a cross-sectional diagram illustrating portions of the displaypanel DISP according to embodiments of the present disclosure, takenalong line X-X′ in FIG. 8 according to an embodiment. In FIG. 9 , thetouch electrode TE is illustrated in the shape of a plate. However, thisis illustrative only, and the touch electrode TE can be mesh shaped. Ina case in which the touch electrode TE is mesh shaped, the open areas OAof the touch electrode TE can be located above the emissive areas ofsubpixels SP.

The first transistor T1, e.g., the driving transistor in each of thesubpixels SP in the active area AA, is disposed on the substrate SUB.

The first transistor T1 comprises a first node electrode NE1corresponding to the gate electrode, a second node electrode NE2corresponding to a source electrode or a drain electrode, a third nodeelectrode NE3 corresponding to a drain electrode or a source electrode,a semiconductor layer SEMI, and the like.

The first node electrode NE1 and the semiconductor layer SEMI can belocated on both sides of a gate insulating film GI to overlap eachother. The second node electrode NE2 can be provided on an insulatinglayer ILD to be in contact with one side of the semiconductor layerSEMI, while the third node electrode NE3 can be provided on theinsulating layer ILD to be in contact with the other side of thesemiconductor layer SEMI.

The emitting device ED can comprise a first electrode E1 correspondingto an anode (or cathode), an emitting layer EL provided on the firstelectrode E1, a second electrode E2 corresponding to a cathode (oranode) provided on the emitting layer EL, and the like.

The first electrode E1 is electrically connected to the second nodeelectrode NE2 of the first transistor T1, exposed through a pixelcontact hole extending through a planarization layer PLN.

The emitting layer EL is provided on the first electrode E1 in theemitting area provided by banks BANK. The emitting layer EL is providedon the first electrode E1 and is comprised of a hole-related layer, anemissive layer, and an electron-related layer stacked in the statedorder or inversely. The second electrode E2 is provided on the side ofthe emitting layer EL opposite to the first electrode E1.

The encapsulation layer ENCAP prevents or at least reduces externalmoisture or oxygen from penetrating the emitting device ED vulnerable toexternal moisture, oxygen, or the like.

The encapsulation layer ENCAP can be a single layer or, as illustratedin FIG. 9 , be comprised of a plurality of layers PAS1, PCL, and PAS2.

For example, in a case in which the encapsulation layer ENCAP iscomprised of the plurality of layers PAS1, PCL, and PAS2, theencapsulation layer ENCAP can comprise one or more inorganicencapsulation layers PAS1 and PAS2 and one or more organic encapsulationlayers PCL. As a specific example, the encapsulation layer ENCAP canhave a structure in which the first inorganic encapsulation layer PAS1,the organic encapsulation layer PCL, and the second inorganicencapsulation layer PAS2 are stacked in order.

Here, the organic encapsulation layer PCL can further comprise at leastone organic encapsulation layer or at least one inorganic encapsulationlayer.

The first inorganic encapsulation layer PAS1 is provided on thesubstrate SUB, on which the second electrode E2 corresponding to thecathode is provided, so that the first inorganic encapsulation layerPAS1 is closest to the emitting device ED. The first inorganicencapsulation layer PAS1 is made of an inorganic insulating material,such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride(SiON), or aluminum oxide (Al₂O₃), which can be deposited at a lowtemperature. Since the first inorganic encapsulation layer PAS1 isdeposited in a low-temperature atmosphere, the first inorganicencapsulation layer PAS1 can prevent the emitting layer EL containing anorganic material vulnerable to a high-temperature atmosphere from beingdamaged during deposition processing.

The organic encapsulation layer PCL can be provided in an area smallerthan the area of the first inorganic encapsulation layer PAS1. In thiscase, the organic encapsulation layer PCL can be configured to exposeboth edges of the first inorganic encapsulation layer PAS1. The organicencapsulation layer PCL can serve as a buffer to reduce stress betweenthe layers caused by bending of the touch display device and serve toenhance planarization performance. The organic encapsulation layer PCLcan be made of, for example, an organic insulating material, such as anacrylic resin, an epoxy resin, polyimide, polyethylene, siliconoxycarbon (SiOC).

In addition, in a case in which the organic encapsulation layer PCL isfabricated by inkjet printing, one or more dams DAM can be provided inthe dam area DA corresponding to the boundary between the non-activearea NA and the active area AA or a portion of the non-active area NA.

For example, as illustrated in FIG. 9 , the dam area DA is locatedbetween a pad area in the non-active area NA and the active area AA. Thepad area refers to a portion of the non-active area NA in which theplurality of X-touch pads X-TP and the plurality of Y-touch pads Y-TPare provided. In the dam area DA, the first dam DAM1 adjacent to theactive area AA and the second dam DAM2 adjacent to the pad area can beprovided.

The one or more dams DAM disposed in the dam area DA can prevent or atleast reduce the organic encapsulation layer PCL in a liquid form fromcollapsing at the boundary between the active area AA and the non-activearea NA and penetrating into the pad area when the organic encapsulationlayer PCL in the liquid form is dropped to the active area AA. Thiseffect can be further increased by the provision of the first dam DAM1and the second dam DAM2 as illustrated in FIG. 9 .

At least one of the first dam DAM1 and the second dam DAM2 can have asingle layer or multilayer structure. For example, at least one of thefirst dam DAM1 and the second dam DAM2 can be simultaneously made of thesame material as at least one of the banks BANK and spacers (not shown).In this case, a dam structure can be provided without additional maskprocessing or an increase in cost.

In addition, as illustrated in FIG. 9 , at least one of the first damDAM1 and the second dam DAM2 can have a structure in which at least oneof the first inorganic encapsulation layer PAS1 and the second inorganicencapsulation layer PAS2 is stacked on the banks BANK.

In addition, the organic encapsulation layer PCL containing an organicmaterial can be located on an inner side of the first dam DAM1, asillustrated in FIG. 9 .

Alternatively, the organic encapsulation layer PCL containing an organicmaterial can be located above at least a portion of the first dam DAM1and the second dam DAM2. For example, the organic encapsulation layerPCL can be located above the first dam DAM1.

The second inorganic encapsulation layer PAS2 can be provided on thesubstrate SUB on which the organic encapsulation layer PCL is provided,so as to cover the top surfaces and side surfaces of the organicencapsulation layer PCL and the first inorganic encapsulation layerPAS1. The second inorganic encapsulation layer PAS2 reduces or preventsor at least reduces external moisture or oxygen from penetrating thefirst inorganic encapsulation layer PAS1 or the organic encapsulationlayer PCL. The second inorganic encapsulation layer PAS2 is made of, forexample, an inorganic insulating material, such as SiNx, SiOx, SiON, orAl₂O₃.

A touch buffer film T-BUF can be provided on the encapsulation layerENCAP. The touch buffer film T-BUF can be located between the touchsensor metal TSM, including the X and Y-touch electrodes X-TE and Y-TEand X and Y-touch electrode connecting lines X-CL and Y-CL, and thesecond electrode E2 of the emitting device ED.

The touch buffer film T-BUF can be designed to maintain a predeterminedminimum distance (e.g., 1 μm) between the touch sensor metal TSM and thesecond electrode E2 of the emitting device ED. Accordingly, this canreduce or prevent parasitic capacitance generated between the touchsensor metal TSM and the second electrode E2 of the emitting device ED,thereby preventing touch sensitivity from being reduced by the parasiticcapacitance.

Without the touch buffer film T-BUF, the touch sensor metal TSMcomprising the X and Y-touch electrodes X-TE and Y-TE and the X andY-touch electrode connecting lines X-CL and Y-CL can be disposed on theencapsulation layer ENCAP.

In addition, the touch buffer film T-BUF can prevent or at least reducethe emitting layer EL containing the organic material from beingpenetrated by a chemical agent (e.g., a developing solution or anetching solution) used in fabrication processing of the touch sensormetal TSM disposed on the touch buffer film T-BUF, external moisture, orthe like. Accordingly, the touch buffer film T-BUF can prevent theemitting layer EL vulnerable to the chemical agent or moisture frombeing damaged.

The touch buffer film T-BUF is made of an organic insulating materialproducible at a low temperature equal to or lower than a predeterminedtemperature (e.g., 100° C.) and having a low dielectric constant of 1 to3 in order to prevent or at least reduce the emitting layer ELcontaining the organic material vulnerable to high temperature frombeing damaged. For example, the touch buffer film T-BUF can be made ofan epoxy-based material or a siloxane-based material. The touch bufferfilm T-BUF made of an inorganic insulating material and having aplanarization performance can prevent or at least reduce the layersPAS1, PCL, and PAS2 included in the encapsulation layer ENCAP from beingdamaged or the touch sensor metal TSM on the touch buffer film T-BUFfrom being fractured in response to the bending of the OLED displaydevice.

According to the mutual capacitance-based touch sensor structure, theX-touch electrode lines X-TEL and the Y-touch electrode lines Y-TEL aredisposed on the touch buffer film T-BUF, and the X-touch electrode linesX-TEL and the Y-touch electrode lines Y-TEL can be disposed such thatthe X-touch electrode lines X-TEL intersect the Y-touch electrode linesY-TEL.

The Y-touch electrode lines Y-TEL can comprise the plurality of Y-touchelectrodes Y-TE and the plurality of Y-touch electrode connecting linesY-CL electrically connecting the plurality of Y-touch electrodes Y-TE.

As illustrated in FIG. 9 , the plurality of Y-touch electrodes Y-TE andthe plurality of Y-touch electrode connecting lines Y-CL can be disposedon different layers, on both sides of a touch insulating film T-ILD.

The plurality of Y-touch electrodes Y-TE can be spaced apart from eachother by predetermined distances in the Y-axis direction. Each of theplurality of Y-touch electrodes Y-TE can be electrically connected tothe other adjacent Y-touch electrodes Y-TE through the Y-touch electrodeconnecting lines Y-CL in the Y-axis direction.

The Y-touch electrode connecting lines Y-CL can be provided on the touchbuffer film T-BUF and exposed through touch contact holes extendingthrough the touch insulating film T-ILD to be electrically connected tothe two adjacent Y-touch electrodes Y-TE in the Y-axis direction.

The Y-touch electrode connecting lines Y-CL can be disposed to overlapthe banks BANK. Accordingly, the aperture ratio can be prevented frombeing decreased by the Y-touch electrode connecting lines Y-CL.

The X-touch electrode lines X-TEL can comprise the plurality of X-touchelectrodes X-TE and the plurality of X-touch electrode connecting linesX-CL electrically connecting the plurality of X-touch electrodes X-TE.The plurality of X-touch electrodes X-TE and the plurality of X-touchelectrode connecting line X-CL can be disposed on different layers, onboth sides of the touch insulating film T-ILD.

The plurality of X-touch electrodes X-TE can be disposed on the touchinsulating film T-ILD, spaced apart from each other by predetermineddistances in the X-axis direction. Each of the plurality of X-touchelectrodes X-TE can be electrically connected to the adjacent otherX-touch electrodes X-TE through the X-touch electrode connecting linesX-CL in the X-axis direction.

The X-touch electrode connecting lines X-CL can be disposed on the sameplane as the X-touch electrodes X-TE to be electrically connected to thetwo adjacent X-touch electrodes X-TE in the X-axis direction withoutseparate contact holes or be integrated with the two adjacent X-touchelectrodes X-TE in the X-axis direction.

The X-touch electrode connecting lines X-CL can be disposed to overlapthe banks BANK. Accordingly, the aperture ratio can be prevented frombeing decreased by the X-touch electrode connecting lines X-CL.

In addition, the Y-touch electrode lines Y-TEL can be electricallyconnected to the touch driving circuit TDC through the Y-touch routinglines Y-TL and the Y-touch pads Y-TP. In the same manner, the X-touchelectrode lines X-TEL can be electrically connected to the touch drivingcircuit TDC through the X-touch routing lines X-TL and the X-touch padsX-TP.

A pad cover electrode covering the X-touch pads X-TP and the Y-touchpads Y-TP can be further disposed.

The X-touch pads X-TP can be provided separately from the X-touchrouting lines X-TL or be provided as extensions of the X-touch routinglines X-TL. The Y-touch pads Y-TP can be provided separately from theY-touch routing lines Y-TL or be provided as extensions of the Y-touchrouting lines Y-TL.

In a case in which the X-touch pads X-TP are extensions of the X-touchrouting lines X-TL and the Y-touch pads Y-TP are extensions of theY-touch routing lines Y-TL, the X-touch pads X-TP, the X-touch routinglines X-TL, the Y-touch pads Y-TP, and the Y-touch routing lines Y-TLcan be comprised of the same material, i.e., a first conductivematerial. The first conductive material can have a single or multilayerstructure made of a metal, such as aluminum Al, titanium T1, copper Cu,or molybdenum Mo, having high corrosion resistance, high acidresistance, and high conductivity.

For example, each of the X-touch pads X-TP, the X-touch routing linesX-TL, the Y-touch pads Y-TP, and the Y-touch routing lines Y-TLcomprised of the first conductive material can have a three-layerstructure, such as Ti/Al/Ti or Mo/Al/Mo.

The pad cover electrode capable of covering the X-touch pads X-TP andthe Y-touch pads Y-TP can be comprised of the same material as the X andY-touch electrodes X-TE and Y-TE, i.e., a second conductive material.The second conductive material can be a transparent conductive material,such as indium tin oxide (ITO) or indium zinc oxide (IZO), having highcorrosion resistance and acid resistance. The pad cover electrodes canbe provided to be exposed from the touch buffer film T-BUF so as to bebonded to the touch driving circuit TDC or to a circuit film on whichthe touch driving circuit TDC is mounted.

The touch buffer film T-BUF can be provided to cover the touch sensormetal TSM so as to prevent the touch sensor metal TSM from beingcorroded by external moisture. For example, the touch buffer film T-BUFcan be made of an organic insulating material or be provided as acircular polarizer or a film made of an epoxy or acrylic material. Thetouch buffer film T-BUF may not be provided on the encapsulation layerENCAP. That is, the touch buffer film T-BUF may not be an essentialcomponent.

The Y-touch routing lines Y-TL can be electrically connected to theY-touch electrodes Y-TE via touch routing line contact holes or beintegrated with the Y-touch electrodes Y-TE.

Each of the Y-touch routing lines Y-TL can extend to the non-active areaNA, past the top and side portions of the encapsulation layer ENCAP andthe dams DAM, so as to be electrically connected to the Y-touch padsY-TP. Accordingly, the Y-touch routing lines Y-TL can be electricallyconnected to the touch driving circuit TDC through the Y-touch padsY-TP.

The Y-touch routing lines Y-TL can deliver the touch-sensing signal fromthe Y-touch electrodes Y-TE to the touch driving circuit TDC or deliverthe touch driving signal, received from the touch driving circuit TDC,to the Y-touch electrodes Y-TE.

The X-touch routing lines X-TL can be electrically connected to theX-touch electrodes X-TE via the touch routing line contact holes or beintegrated with the X-touch electrodes X-TE.

The X-touch routing lines X-TL can extend to the non-active area NA,past the top and side portions of the encapsulation layer ENCAP and thedams DAM, so as to be electrically connected to the X-touch pads Y-TP.Accordingly, the X-touch routing lines X-TL can be electricallyconnected to the touch driving circuit TDC through the X-touch padsX-TP.

The X-touch routing lines X-TL can deliver the touch driving signal,received from the touch driving circuit TDC, to the X-touch electrodesX-TE or deliver touch-sensing signal from the X-touch electrodes X-TE tothe touch driving circuit TDC.

The arrangement of the X-touch routing lines X-TL and the Y-touchrouting lines Y-TL can be modified variously depending on the designspecification of the panel.

A touch protective film PAC can be disposed on the X-touch electrodesX-TE and the Y-touch electrodes Y-TE. The touch protective film PAC canextend to an area in front of or behind the dams DAM so as to bedisposed on the X-touch routing lines X-TL and the Y-touch routing linesY-TL.

The cross-sectional diagram of FIG. 9 is conceptual illustration of thestructure. The positions, thicknesses, or widths of the patterns (e.g.,various layers or electrodes) can vary depending on the direction orposition of view, the structures for connecting the patterns can bemodified, additional layers other than the plurality of illustratedlayers can be further provided, and some of the plurality of illustratedlayers can be omitted or integrated. For example, the width of the banksBANK can be narrower than that illustrated in the drawings, and theheight of the dams DAM can be lower or higher than that illustrated inthe drawings. In addition, the cross-sectional diagram of FIG. 9illustrates a structure in which the touch electrode TE, the touchrouting lines TL, and the like are disposed on the entirety of thesubpixels SP in order to illustrate a structure connected to the touchpads TP along inclines of the touch routing lines TL and theencapsulation layer ENCAP. However, in a case in which the touchelectrode TE or the like is mesh-shaped as described above, the openareas OA of the touch electrode TE can be located above the emittingareas of the subpixels SP. In addition, a color filter CF (see FIGS. 10and 11 ) can be further disposed on the encapsulation layer ENCAP. Thecolor filter CF can be located on the touch electrode TE or between theencapsulation layer ENCAP and the touch electrode TE.

FIGS. 10 and 11 are diagrams illustrating a cross-sectional structure ofthe display panel DISP including the color filter CF according toembodiments of the present disclosure.

Referring to FIGS. 10 and 11 , in a case in which the touch panel TSP isdisposed within the display panel DISP and the display panel DISP isprovided as an OLED display panel, the touch panel TSP can be located onthe encapsulation layer ENCAP in the display panel DISP. That is, thetouch sensor metals TSM, such as the plurality of touch electrodes TEand the plurality of touch routing lines TL, can be located on theencapsulation layer ENCAP in the display panel DISP.

The touch electrode TE being provided on the encapsulation layer ENCAPas described above can be made as the touch electrode TE withoutsignificantly influencing the display performance or the formation of adisplay-related layer.

Referring to FIGS. 10 and 11 , the second electrode E2 that can be thecathode of the OLED can be located below the encapsulation layer ENCAP.

The thickness T of the encapsulation layer ENCAP can be, for example, 1μm or more.

Since the thickness of the encapsulation layer ENCAP is designed to be 1μm or more as described above, parasitic capacitance generated betweenthe second electrode E2 and the touch electrodes TE of the OLED can bereduced, thereby preventing touch sensitivity from being reduced by theparasitic capacitance.

As described above, each of the plurality of touch electrodes TE ispatterned in the shape of a mesh, in which the electrode metal EM hastwo or more open areas OA. Each of the two or more open areas OA cancorrespond to one or more subpixels or the emitting areas thereof whenviewed in a vertical direction.

As described above, the electrode metal EM of the touch electrode TE canbe patterned such that the emitting area of one or more subpixels SP isprovided in a position corresponding to each of the two or more openareas OA present in the area of the touch electrode TE when viewed in aplan view. Accordingly, the luminous efficiency of the display panelDISP can be improved.

As illustrated in FIGS. 10 and 11 , a black matrix BM can be provided inthe display panel DISP. The color filter CF can be further provided inthe display panel DISP.

The position of the black matrix BM can correspond to the position ofthe electrode metal EM of the touch electrode TE.

The positions of the plurality of color filters CF correspond to thepositions of the plurality of touch electrodes TE or the position of theelectrode metal EM constituting the plurality of touch electrodes TE.

Since the plurality of color filters CF are located in positionscorresponding to the plurality of open areas OA as described above, theluminous performance of the display panel DISP can be improved.

The vertical positional relationship between the plurality of colorfilters CF and the plurality of touch electrodes TE will be described asfollows.

As illustrated in FIG. 10 , the plurality of color filters CF and theblack matrix BM can be located on the plurality of touch electrodes TE.

In this case, the plurality of color filters CF and the black matrix BMcan be located on the overcoat layer OC disposed on the plurality oftouch electrodes TE. Here, the overcoat layer OC can be the same layeras or a different layer from the touch protective film PAC illustratedin FIG. 9 .

Alternatively, as illustrated in FIG. 11 , the plurality of colorfilters CF and the black matrix BM can be located below the plurality oftouch electrodes TE.

In this case, the plurality of touch electrodes TE can be located on theovercoat layer OC on the plurality of color filters CF and the blackmatrix BM. The overcoat layer OC can be the same layer as or a differentlayer from the touch buffer film T-BUF or the touch insulating filmT-ILD illustrated in FIG. 9 . Alternatively, the touch buffer film T-BUFor the touch insulating film T-ILD can be disposed in a manner separatefrom the overcoat layer OC.

Due to the vertical positional relationship between the touch electrodeTE and a display driving configuration being adjusted as describedabove, a touch sensing configuration can be disposed without degradingthe display performance.

Furthermore, embodiments of the present disclosure can provide a methodto improve touch sensitivity by increasing an area of the touchelectrode TE, without disturbing a light-emitting area of the subpixelSP by the opening area OA included in the touch electrode TE.

FIG. 12 is a plane view illustrating an example of a structure of thetouch electrode TE disposed in the display panel DISP according toembodiments of the present disclosure. FIG. 13 is a cross-sectional viewof I-I′ portion illustrated in FIG. 12 according to embodiments of thepresent disclosure. FIG. 14 is a cross-sectional view of II-II′ portionillustrated in FIG. 12 according to embodiments of the presentdisclosure. FIG. 15 is a cross-sectional view of III-III′ portionillustrated in FIG. 12 according to embodiments of the presentdisclosure.

Referring to FIG. 12 , it illustrates an example of a structure that theX-touch electrode X-TE and the Y-touch electrode Y-TE are disposed on anarea where the X-touch electrode line X-TEL and the Y-touch electrodeline X-TEL cross.

FIG. 12 exemplary illustrates a case that the touch electrode TE has ashape illustrated in FIG. 5B, but embodiments of the present disclosureare not limited to this.

The electrode metal EM having the opening area OA is cut and divided asthe X-touch electrode X-TE and the Y-touch electrode Y-TE.

The X-touch electrode X-TE and the Y-touch electrode Y-TE can be made ofa second touch sensor metal TSM2 disposed on the touch insulating filmT-ILD.

One of the X-touch electrode connecting line X-CL and the Y-touchelectrode connecting line Y-CL can be made of the second touch sensormetal TSM2. The other one of the X-touch electrode connecting line X-CLand the Y-touch electrode connecting line Y-CL can be made of a firsttouch sensor metal TSM1 disposed under the touch insulating film T-ILD.

In the present disclosure, a layer where the first touch sensor metalTSM1 is disposed can be “a first layer”, and a layer where the secondtouch sensor metal TSM2 is disposed can be “a second layer.”

As the touch electrode TE is made of the second touch sensor metal TSM2and a part of the touch electrode connecting line CL is made of thefirst touch sensor metal TSM1, an area of the second touch sensor metalTSM2 is greater than an area of the first touch sensor metal TSM1.

The Y-touch electrode Y-TE can be connected by the Y-touch electrodeconnecting line Y-CL made of the second touch sensor metal TSM2 disposedon a same layer with the Y-touch electrode Y-TE.

The X-touch electrode X-TE can be connected by the X-touch electrodeconnecting line X-CL made of the first touch sensor metal TSM1 disposedon a different layer from the X-touch electrode X-TE.

The X-touch electrode X-TE and the X-touch electrode connecting lineX-CL, for example, can be electrically connected to each other through acontact hole included in the touch insulating film T-ILD.

The touch insulating film T-ILD can be disposed on at least a part areabetween a layer where the first touch sensor metal TSM1 is disposed anda layer where the second touch sensor metal TSM2 is disposed.

The touch insulating film T-ILD can be disposed on at least a part areaof an area overlapping the second touch sensor metal TSM2 constitutingthe X-touch electrode X-TE or the Y-touch electrode Y-TE.

The touch insulating film T-ILD can be positioned under the second touchsensor metal TSM2, and can have a step difference.

The touch electrode TE disposed on the touch insulating film T-ILD andmade of the second touch sensor metal TSM2 can be disposed along asurface of the touch insulating film T-ILD having the step difference.

As the touch electrode TE is disposed on the surface of the touchinsulating film T-ILD having the step difference, thus an overall areaof the touch electrode TE can increase compared to a case of disposingplanarly on an area having an identical area.

FIG. 13 illustrates an example of a cross-sectional structure of aportion that the X-touch electrode X-TE and the X-touch electrodeconnecting line X-CL are electrically connected in FIG. 12 .

The touch insulating film T-ILD can be disposed between the X-touchelectrode connecting line X-CL made of the first touch sensor metal TSM1and the X-touch electrode X-TE made of the second touch sensor metalTSM2.

The touch insulating film T-ILD can include a first portion having afirst thickness Th1. The touch insulating film T-ILD can include asecond portion having a second thickness Th2. The second thickness Th2can be smaller than the first thickness Th1.

The touch insulating film T-ILD can include an inclined surfacepositioned between the first portion and the second portion. A portionhaving the inclined surface between the first portion and the secondportion, in some cases, can be seen as a part of the first portion. Insome other cases, the touch insulating film T-ILD can include aninclined surface positioned outside of the second portion. A portionhaving the inclined surface positioned outside of the second portion,can also be seen as a part of the second portion.

The touch insulating film T-ILD, in some cases, can further include atleast one portion having a thickness different from the first thicknessTh1 and the second thickness Th2.

The touch insulating film T-ILD, for example, can be formed to includethe first portion and the second portion having different thickness by ahalf-tone mask process.

A contact hole CHa can be formed in the first portion of the touchinsulating film T-ILD.

The X-touch electrode X-TE can be electrically connected to the X-touchelectrode connecting line X-CL through the contact hole CHa.

As the touch insulating film T-ILD has the step difference by the firstportion and the second portion, thus the X-touch electrode X-TE can bedisposed as a curved shape along the surface of the touch insulatingfilm T-ILD having the step difference.

A part of the X-touch electrode X-TE can be disposed along the inclinedsurface between the first portion and the second portion of the touchinsulating film T-ILD.

A top surface of the X-touch electrode X-TE disposed on the touchinsulating film T-ILD can have a curved shape. On the other hand, a topsurface of the X-touch electrode connecting line X-CL disposed under thetouch insulating film T-ILD can be a flat shape.

As the X-touch electrode X-TE is disposed along the surface of the touchinsulating film T-ILD having the step difference, thus an overall areaof the X-touch electrode X-TE disposed on the touch insulating filmT-ILD can increase.

As an overall area of the X-touch electrode X-TE disposed on anidentical area increase, thus touch sensitivity can be improved withoutincreasing an area where the X-touch electrode X-TE is disposed.

Furthermore, as the X-touch electrode X-TE is disposed along theinclined surface of the touch insulating film T-ILD, even an area wherethe X-touch electrode X-TE is disposed is increased a little more, aviewing angle of a light emitted from the light-emitting element EDpositioned under the X-touch electrode X-TE may not be dropped.

For specific example, referring to FIGS. 14 and 15 , FIG. 14 illustratesan example that the first touch sensor metal TSM1 is positioned underthe second touch sensor metal TSM2, and FIG. 15 illustrates an examplethat the first touch sensor metal TSM1 is not positioned under thesecond touch sensor metal TSM2.

Referring to FIG. 14 , the touch insulating film T-ILD can include thefirst portion having the first thickness Th1 and the second portionhaving the second thickness Th2 positioned under the second touch sensormetal TSM2.

The first portion of the touch insulating film T-ILD can be positionedunder a central portion of the second touch sensor metal TSM2. Thesecond portion of the touch insulating film T-ILD can be positionedunder an outer portion of the second touch sensor metal TSM2.

The second touch sensor metal TSM2 can be disposed on a lower positiontoward from the central portion to the outer portion.

As at least a part of the second touch sensor metal TSM2 includes aninclined portion, thus an area where the second touch sensor metal TSM2can be disposed without dropping a viewing angle of a light emitted fromthe light-emitting element ED positioned under the encapsulation layerENCAP can be increased.

As an area of the second touch sensor metal TSM2 constituting the touchelectrode TE increases, touch sensitivity is improved and a resistanceis decreased, accordingly an area of the first touch sensor metal TSM1constituting a part of the touch electrode connecting line CL can bedecreased.

For example, a width W1 of the first touch sensor metal TSM1 can besmaller than a width W2 of the second touch sensor metal TSM2. Thesecond touch sensor metal TSM2 can be disposed as wide as possible in arange not dropping a viewing angle.

The touch insulating film T-ILD can be disposed to have the stepdifference on an area where the first touch sensor metal TSM1 is notdisposed and only the second touch sensor metal TSM2 is disposed.

Referring to FIG. 15 , the touch insulating film T-ILD can be disposedon an area where the first touch sensor metal TSM1 is not disposed.

The touch insulating film T-ILD can include the first portion having thefirst thickness Th1 and the second portion having the second thicknessTh2.

The second touch sensor metal TSM2 can be disposed along the surface ofthe touch insulating film T-ILD having the step difference.

Thus, a part of the second touch sensor metal TSM2 can be disposed alongthe inclined surface of the touch insulating film T-ILD on an area wherethe first touch sensor metal TSM1 is not disposed.

As the second touch sensor metal TSM2 is disposed widely along thesurface of the touch insulating film T-ILD having the step difference,thus touch sensitivity can be improved.

Furthermore, the second touch sensor metal TSM2 can be disposed on thetouch insulating film T-ILD having the step difference, and partiallydisposed outside of the touch insulating film T-ILD.

Referring to a portion indicated by 1401 illustrated in FIG. 14 and aportion indicated by 1501 illustrated in FIG. 15 , a part of the secondtouch sensor metal TSM2 can be disposed outside of the touch insulatingfilm T-ILD.

The part of the second touch sensor metal TSM2 disposed outside of thetouch insulating film T-ILD can be positioned on an area where the firsttouch sensor metal TSM1 is not disposed.

A bottom surface of the part of the second touch sensor metal TSM2disposed outside of the touch insulating film T-ILD can contact a layersame as a layer that a bottom surface of the first touch sensor metalTSM1 contacts.

Such as examples illustrated in FIGS. 14 and 15 , the bottom surface ofthe part of the second touch sensor metal TSM2 and the bottom surface ofthe first touch sensor metal TSM1 can contact a top surface of the touchbuffer film T-BUF. In a case that the touch buffer film T-BUF is notdisposed on the encapsulation layer ENCAP, the bottom surface of thepart of the second touch sensor metal TSM2 and the bottom surface of thefirst touch sensor metal TSM1 can contact a top surface of theencapsulation layer ENCAP.

As the second touch sensor metal TSM2 is disposed along the inclinedsurface of the touch insulating film T-ILD, a part of the second touchsensor metal TSM2 can be disposed outside of the inclined surface of thetouch insulating film T-ILD and an area of the touch electrode TE can beincreased.

Such as described above, embodiments of the present disclosure canincrease an overall area of the touch electrode TE by a structure of thestep difference of the touch insulating film T-ILD.

Furthermore, embodiments of the present disclosure can increase anoverall area of the touch electrode TE more, by forming a contact holein the touch insulating film T-ILD additionally, or forming a structureof the step difference of the touch insulating film T-ILD on variouspositions.

FIG. 16 is a plane view illustrating another example of a structure ofthe touch electrode TE disposed in the display panel DISP according toembodiments of the present disclosure. FIG. 17 is a cross-sectional viewof IV-IV′ portion illustrated in FIG. 16 according to embodiments of thepresent disclosure.

Referring to FIGS. 16 and 17 , they illustrate an example of a structurethat a contact hole which he X-touch electrode X-TE and the X-touchelectrode connecting line X-CL are connected is added.

The touch insulating film T-ILD can be disposed on the first touchsensor metal TSM1 constituting the X-touch electrode connecting lineX-CL.

The touch insulating film T-ILD can include the first portion having thefirst thickness Th1 and the second portion having the second thicknessTh2.

The second touch sensor metal TSM2 constituting the X-touch electrodeX-TE can be disposed on a top surface of the first portion and thesecond portion of the touch insulating film T-ILD and the inclinedsurface between the first portion and the second portion.

The X-touch electrode X-TE can be electrically connected to the X-touchelectrode connecting line X-CL through the contact hole CHa positionedin the first portion of the touch insulating film T-ILD. The X-touchelectrode X-TE can be electrically connected to the X-touch electrodeconnecting line X-CL through a contact hole CHb positioned in the secondportion of the touch insulating film T-ILD.

The contact hole CHa positioned in the first portion of the touchinsulating film T-ILD can be positioned on an area where the first touchsensor metal TSM1 and the second touch sensor metal TSM2 cross.

The contact hole CHb positioned in the second portion of the touchinsulating film T-ILD can be positioned on an area where the first touchsensor metal TSM1 and the second touch sensor metal TSM2 are disposed ina same direction.

As the contact hole CHb is added in the second portion of the touchinsulating film T-ILD, thus an area of the X-touch electrode X-TEconstituted by the second touch sensor metal TSM2 disposed along thesurface of the touch insulating film T-ILD can increase more.

In an area where the second touch sensor metal TSM2 and the first touchsensor metal TSM1 are not connected, or the first touch sensor metalTSM1 is not positioned under the second touch sensor metal TSM2, thesecond touch sensor metal TSM2 can be disposed similarly with astructure described in FIGS. 14 and 15 , and thus an area of the touchelectrode TE can be increased.

Such as described above, the touch insulating film T-ILD positionedunder the second touch sensor metal TSM2 constituting the touchelectrode TE has the step difference, or includes an additional contacthole, thus an area of the touch electrode TE disposed on the touchinsulating film T-ILD can be increased.

Alternatively, a part of the touch insulating film T-ILD positionedunder the second touch sensor metal TSM2 is removed, and an area wherethe second touch sensor metal TSM2 is disposed can be increased.

FIG. 18 is a plane view illustrating other example of a structure of thetouch electrode TE disposed in the display panel DISP according toembodiments of the present disclosure. FIG. 19 is a cross-sectional viewof V-V′ portion illustrated in FIG. 18 according to embodiments of thepresent disclosure.

Referring to FIGS. 18 and 19 , the touch insulating film T-ILD can bedisposed on the first touch sensor metal TSM1 constituting the X-touchelectrode connecting line X-CL.

The touch insulating film T-ILD can include the first portion having thefirst thickness Th1 and the second portion having the second thicknessTh2.

The second touch sensor metal TSM2 constituting the X-touch electrodeX-TE can be disposed on the touch insulating film T-ILD.

A part of the touch insulating film T-ILD positioned under the secondtouch sensor metal TSM2 can be removed.

For example, a part of the touch insulating film T-ILD can be removed onan area where the second touch sensor metal TSM2 and the first touchsensor metal TSM1 are disposed in a same direction.

As the touch insulating film T-ILD is not disposed on an area where thesecond touch sensor metal TSM2 and the first touch sensor metal TSM1overlap, thus the second touch sensor metal TSM2 can be electricallyconnected to the first touch sensor metal TSM1 on a corresponding area.

A structure that the X-touch electrode X-TE is electrically connected tothe X-touch electrode connecting line X-CL outside of the second portionof the touch insulating film T-ILD can be implemented.

A remained portion of the touch insulating film T-ILD can be disposed tohave a structure of the step difference.

Looking an overall structure that the second touch sensor metal TSM2 isdisposed, the second touch sensor metal TSM2 can be disposed along theinclined surface of the touch insulating film T-ILD having a structureof the step difference on an area where the second touch sensor metalTSM2 is electrically connected to the first touch sensor metal TSM1through the contact hole CHa.

The second touch sensor metal TSM2 can be disposed on an area where thetouch insulating film T-ILD is removed and can be electrically connectedto the first touch sensor metal TSM1.

The second touch sensor metal TSM2 can pass an area where the touchinsulating film T-ILD is removed and can be disposed along the surfaceof the touch insulating film T-ILD having a structure of the stepdifference again.

The second touch sensor metal TSM2 can be disposed on two or moreportions of the touch insulating film T-ILD having the step difference.An area of the second touch sensor metal TSM2 disposed on the touchinsulating film T-ILD can increase more.

Thus, the second touch sensor metal TSM2 can be disposed to have alarger area while maintaining a structure not to drop a viewing angle.Touch sensitivity can be improved by an increase of an area of thesecond touch sensor metal TSM2 without affecting a display.

Furthermore, as a part of the touch insulating film T-ILD can be removedin a structure for an increase of an arrangement area of the secondtouch sensor metal TSM2, a structure that the second touch sensor metalTSM2 and the first touch sensor metal TSM1 are connected can beimplemented without a contact hole in the touch insulating film T-ILD.

FIG. 20 is a plane view illustrating other example of a structure of thetouch electrode TE disposed in the display panel DISP according toembodiments of the present disclosure. FIG. 21 is a cross-sectional viewof VI-VI′ portion illustrated in FIG. 20 according to embodiments of thepresent disclosure.

Referring to FIGS. 20 and 21 , the X-touch electrode connecting lineX-CL made of the first touch sensor metal TSM1 can be disposed.

The touch insulating film T-ILD can be disposed on a layer where thefirst touch sensor metal TSM1 is disposed. The touch insulating filmT-ILD can include the first portion having the first thickness Th1 andthe second portion having the second thickness Th2.

The X-touch electrode X-TE made of the second touch sensor metal TSM2can be disposed on the touch insulating film T-ILD.

The touch insulating film T-ILD may not be disposed on a part area of anarea overlapping the second touch sensor metal TSM2. The touchinsulating film T-ILD can be removed on a part area of the areaoverlapping the second touch sensor metal TSM2.

An area where the touch insulating film T-ILD is removed can be an areawhere the first touch sensor metal TSM1 is disposed. The area where thetouch insulating film T-ILD is removed can be an area where the firsttouch sensor metal TSM1 and the second touch sensor metal TSM2 aredisposed in a same direction.

The second touch sensor metal TSM2 and the first touch sensor metal TSM1can be connected to each other on an area where the touch insulatingfilm T-ILD is removed.

The X-touch electrode X-TE made of the second touch sensor metal TSM2and the X-touch electrode connecting line X-CL made of the first touchsensor metal TSM1 can be electrically connected on an area where thetouch insulating film T-ILD is removed.

As the X-touch electrode X-TE and the X-touch electrode connecting lineX-CL are electrically connected to each other on an area where the touchinsulating film T-ILD is removed, thus a contact hole for an electricalconnection between the X-touch electrode X-TE and the X-touch electrodeconnecting line X-CL may not be formed in the touch insulating filmT-ILD.

As the X-touch electrode X-TE is disposed along the surface of the touchinsulating film T-ILD having the step difference, thus an area of theX-touch electrode X-TE can be increased and touch sensitivity can beimproved. As the X-touch electrode X-TE is connected to the X-touchelectrode connecting line X-CL outside of the touch insulating filmT-ILD, an electrical connecting structure with the X-touch electrodeconnecting line X-CL can be implemented easily without a contact hole.

The embodiments of the present disclosure described above will bebriefly described as follows.

A touch display device according to embodiments of the presentdisclosure can include a substrate SUB on which a plurality oflight-emitting elements ED are disposed, an encapsulation layer ENCAPsealing the plurality of light-emitting elements ED, a plurality oftouch electrode lines TEL disposed on the encapsulation layer ENCAP,being made of at least a part of a first touch sensor metal TSM1disposed on a first layer on the encapsulation layer ENCAP and a secondtouch sensor metal TSM2 at least partially disposed on a second layer onthe first layer, and an area of the second touch sensor metal TSM2 isgreater than an area of the first touch sensor metal TSM1, and a touchinsulating film T-ILD disposed on at least a part area of an areabetween the first layer and the second layer, and including a firstportion having a first thickness and a second portion having a secondthickness smaller than the first thickness positioned under the secondtouch sensor metal TSM2.

The first portion of the touch insulating film T-ILD can be positionedunder a central portion of the second touch sensor metal TSM2. Thesecond portion of the touch insulating film T-ILD can be positionedunder an outer portion of the second touch sensor metal TSM2.

A part of the second touch sensor metal TSM2 can be disposed on aninclined surface of the touch insulating film T-ILD on an area otherthan an area where the first touch sensor metal TSM1 is disposed.

A part of the second touch sensor metal TSM2 can be disposed on an areaother than an area where the touch insulating film T-ILD is disposed.The part of the second touch sensor metal TSM2 can be disposed on anarea other than an area where the first touch sensor metal TSM1 isdisposed. A layer which a bottom surface of the part of the second touchsensor metal TSM2 contacts can be identical to a layer which a bottomsurface of the first touch sensor metal TSM1 contacts.

A surface area of the second touch sensor metal TSM2 can be greater thanan area on a plane of an area where the second touch sensor metal TSM2is disposed. A width of the second touch sensor metal TSM2 can begreater than a width of the first touch sensor metal TSM1.

The second touch sensor metal TSM2 can be electrically connected to thefirst touch sensor metal TSM1 through a contact hole positioned in thefirst portion of the touch insulating film T-ILD.

The second touch sensor metal TSM2 can be electrically connected to thefirst touch sensor metal TSM1 through a first contact hole positioned inthe first portion of the touch insulating film T-ILD and a secondcontact hole positioned in the second portion of the touch insulatingfilm T-ILD.

The second touch sensor metal TSM2 can be electrically connected to thefirst touch sensor metal TSM1 outside of the second portion of the touchinsulating film T-ILD.

At least one of the plurality of touch electrode lines TEL can include aplurality of touch electrodes TE made of the second touch sensor metalTSM2, and a plurality of touch electrode connecting lines CL made of thefirst touch sensor metal TSM1 and connecting two adjacent touchelectrodes TE of the plurality of touch electrodes TE electrically eachother.

A touch display device according to embodiments of the presentdisclosure can include a substrate SUB on which a plurality oflight-emitting elements ED are disposed, an encapsulation layer ENCAPsealing the plurality of light-emitting elements ED, a first touchsensor metal TSM1 disposed on a first layer on the encapsulation layerENCAP, a second touch sensor metal TSM2 disposed on a second layer onthe first layer, and a touch insulating film T-ILD disposed on at leasta part area of an area between the first layer and the second layer andincluding a first portion having a first thickness and a second portionhaving a second thickness smaller than the first thickness positioned onan area overlapping the second touch sensor metal TSM2.

A touch display device according to embodiments of the presentdisclosure can include a substrate SUB on which a plurality oflight-emitting elements ED are disposed, an encapsulation layer ENCAPsealing the plurality of light-emitting elements ED, a plurality oftouch electrode connecting lines CL disposed on a first layer on theencapsulation layer ENCAP, a plurality of touch electrodes TE disposedon a second layer on the first layer, and a touch insulating film T-ILDdisposed on at least a part area of an area between the first layer andthe second layer.

A top surface of each of the plurality of touch electrode connectinglines CL can be flat, and a top surface of at least one of the pluralityof touch electrodes TE can be curved.

According to embodiments of the present disclosure described above, asthe touch insulating film T-ILD positioned under the touch electrode TEis disposed to have the step difference, thus the touch electrode TE canbe disposed widely along the surface of the touch insulating film T-ILDhaving the step difference and touch sensitivity can be improved.

Furthermore, since a position which the touch electrode TE is disposedbecome lower toward from a central portion to an outer portion, an areaof the touch electrode TE increases without reducing a viewing angle ofa light emitted from the light-emitting element ED positioned under thetouch electrode TE, thus touch sensitivity can be improved withoutreducing a display quality.

The above description has been presented to enable any person skilled inthe art to make and use the technical idea of the present disclosure,and has been provided in the context of a particular application and itsrequirements. Various modifications, additions and substitutions to thedescribed embodiments will be readily apparent to those skilled in theart, and the general principles defined herein may be applied to otherembodiments and applications without departing from the spirit and scopeof the present disclosure. The above description and the accompanyingdrawings provide an example of the technical idea of the presentdisclosure for illustrative purposes only. That is, the disclosedembodiments are intended to illustrate the scope of the technical ideaof the present disclosure. Thus, the scope of the present disclosure isnot limited to the embodiments shown, but is to be accorded the widestscope consistent with the claims. The scope of protection of the presentdisclosure should be construed based on the following claims, and alltechnical ideas within the scope of equivalents thereof should beconstrued as being included within the scope of the present disclosure.

What is claimed is:
 1. A touch display device comprising: a substrate onwhich a plurality of light-emitting elements are disposed; anencapsulation layer sealing the plurality of light-emitting elements; aplurality of touch electrode lines disposed on the encapsulation layer,the plurality of touch electrode lines comprising at least a part of afirst touch sensor metal disposed in a first layer on the encapsulationlayer and a second touch sensor metal at least partially disposed in asecond layer on the first layer, and an area of the second touch sensormetal is greater than an area of the first touch sensor metal; and atouch insulating film disposed on at least a portion of an area betweenthe first layer and the second layer, the touch insulating filmincluding a first portion having a first thickness and a second portionhaving a second thickness that is less than the first thicknesspositioned under the second touch sensor metal, wherein a part of thesecond touch sensor metal is disposed on an area other than an areawhere the touch insulating film is disposed.
 2. The touch display deviceof claim 1, wherein the first portion of the touch insulating film ispositioned under a central portion of the second touch sensor metal, andthe second portion of the touch insulating film is positioned under anouter portion of the second touch sensor metal.
 3. The touch displaydevice of claim 1, wherein a part of the second touch sensor metal isdisposed on an inclined surface of the touch insulating film on an areaother than an area where the first touch sensor metal is disposed. 4.The touch display device of claim 1, wherein the part of the secondtouch sensor metal is disposed on an area other than an area where thefirst touch sensor metal is disposed.
 5. The touch display device ofclaim 1, wherein a layer which a bottom surface of the part of thesecond touch sensor metal contacts is in a same layer with a layer whicha bottom surface of the first touch sensor metal contacts.
 6. The touchdisplay device of claim 1, wherein a surface area of the second touchsensor metal is greater than an area on a plane of an area where thesecond touch sensor metal is disposed.
 7. The touch display device ofclaim 1, wherein a width of the second touch sensor metal is greaterthan a width of the first touch sensor metal.
 8. The touch displaydevice of claim 1, wherein the second touch sensor metal is electricallyconnected to the first touch sensor metal through a contact holepositioned in the first portion of the touch insulating film.
 9. Thetouch display device of claim 1, wherein the second touch sensor metalis electrically connected to the first touch sensor metal through afirst contact hole positioned in the first portion of the touchinsulating film and a second contact hole positioned in the secondportion of the touch insulating film.
 10. The touch display device ofclaim 1, wherein the second touch sensor metal is electrically connectedto the first touch sensor metal outside of the second portion of thetouch insulating film.
 11. The touch display device of claim 1, whereinat least one of the plurality of touch electrode lines comprises: aplurality of touch electrodes comprising the second touch sensor metal;and a plurality of touch electrode connecting lines comprising the firsttouch sensor metal, the plurality of touch electrode connecting lineselectrically connecting together two adjacent touch electrodes of theplurality of touch electrodes.
 12. A touch display device comprising: asubstrate on which a plurality of light-emitting elements are disposed;an encapsulation layer sealing the plurality of light-emitting elements;a first touch sensor metal disposed in a first layer on theencapsulation layer; a second touch sensor metal disposed in a secondlayer on the first layer; and a touch insulating film disposed on atleast a portion of an area between the first layer and the second layer,the touch insulating film including a first portion having a firstthickness and a second portion having a second thickness that is lessthan the first thickness positioned on an area overlapping the secondtouch sensor metal, wherein a part of the second touch sensor metal isdisposed on an area other than an area where the touch insulating filmis disposed.
 13. The touch display device of claim 12, wherein the firstportion of the touch insulating film is positioned under a centralportion of the second touch sensor metal, and the second portion of thetouch insulating film is positioned under an outer portion of the secondtouch sensor metal.
 14. The touch display device of claim 12, wherein apart of the second touch sensor metal is disposed on an inclined surfacebetween the first portion and the second portion of the touch insulatingfilm.
 15. The touch display device of claim 12, wherein a portion of thearea overlapping the second touch sensor metal is an area other than anarea where the first touch sensor metal is disposed and an area wherethe touch insulating film is disposed.
 16. A touch display devicecomprising: a substrate on which a plurality of light-emitting elementsare disposed; an encapsulation layer sealing the plurality oflight-emitting elements; a plurality of touch electrode connecting linesdisposed in a first layer on the encapsulation layer; a plurality oftouch electrodes disposed in a second layer on the first layer; and atouch insulating film disposed on at least a portion of an area betweenthe first layer and the second layer, wherein a top surface of each ofthe plurality of touch electrode connecting lines is flat, and a topsurface of at least one of the plurality of touch electrodes is curved,in an area where the plurality of touch electrode connecting lines andthe plurality of touch electrodes overlap.
 17. The touch display deviceof claim 16, wherein the touch insulating film positioned on an areaoverlapping the plurality of touch electrodes includes a first portionhaving a first thickness and a second portion having a second thicknessthat is less than the first thickness.
 18. The touch display device ofclaim 17, wherein at least one of the plurality of touch electrodes iselectrically connected to at least one of the plurality of touchelectrode connecting lines through a contact hole positioned in thefirst portion of the touch insulating film.
 19. The touch display deviceof claim 17, wherein at least one of the plurality of touch electrodesis electrically connected to at least one of the plurality of touchelectrode connecting lines outside of the second portion of the touchinsulating film.